Teramics design team has experience in the development of > 500 custom high frequency MMICs, packages, passives and Antennas from definition to volume production.
Teramics focus is in custom MMIC and RFIC design in GaAs, GaN, InP and SiGe processes, high frequency modules, components and sub-systems. Our capabilities include managing the complete supply chain process including foundry relationship, modeling, design, wafer testing, dicing/sorting, mm-wave surface-mount packaging, back-modeling and test.
- GaAs MESFET, HFET, Phemt, HBT, VPIN
- InP HBT, HEMT
- GaN HEMT
- SiGe BiCMOS
- Si CMOS
- Surface-Mount Packaging, Overmold, Air-cavity (laminate, Ceramic)
- Hermetic packaging to mm-wave frequencies
- Passives: Filters, Duplexers, Dividers, Couplers
First Class Foundries
Teramics has working relationships with a number of leading semiconductor foundries WIN Semiconductor®, Gree®, GCS®, UMS®, Qorvo®, NGC®, HRL®, BAE®, Raytheon®, Teledyne®, Keysight®, TowerJazz®, Global Foundries®, iHP®, and ST®.