Design Services

Teramics provides turn-key services for high frequency products to 300GHz. Our core competencies lie in the design of mm-wave ICs, surface mount packages, PCBs, Passives and Antennas.

 
Teramics’ core competency is in design of Integrated circuits and Transceivers from DC to sub-THz such as:
  • Ka, Q, V, E and W-band Transceivers
  • Low noise, Variable gain, distributed, limiting and Power amplifiers
  • Frequency Up and Down Converters, image-reject and balanced, fundamental and sub-harmonic
  • Low Phase Noise VCOs
  • Frequency prescalers
  • Frequency multipliers
  • Detectors
  • Variable Attenuators
  • Phase Shifters
  • Switches
  • TIA and Drivers for optical
Simulation tools:
  • Agilent ADS®, Cadence Virtuoso®, Agilent Golden gate®, AWR Microwave office® circuit simulators
  • ANSYS HFSS®, Agilent EMPRO® and Momentum®, CST® and Sonnet® Electromagnetic Field simulators
  • Agilent Spectrasys® system simulator

Design Capabilities

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  • Device Design and Modeling Software
  • Circuit Design and Simulation Software
  • System Design and Simulation Software
  • Planar and 3D EM Simulation

Technologies

Teramics specializes in a specific set of technology areas and market segments. Teramics focus is in custom MMIC and RFIC design in GaAs, GaN, InP and SiGe processes, high frequency modules, components and sub-systems.

Teramics design team has experience in the development of > 500 custom high frequency MMICs, packages, passives and Antennas from definition to volume production. Teramics can manage the complete supply chain process including foundry relationship, modeling, design, wafer testing, dicing/sorting, mm-wave surface-mount packaging, back-modeling and test. 

  • GaAs MESFET, HFET, Phemt, HBT, VPIN
  • InP HBT, HEMT
  • GaN HEMT
  • SiGe BiCMOS
  • Si CMOS
  • Surface-Mount Packaging, Overmold, Air-cavity (laminate, Ceramic)
  • Hermetic packaging to mm-wave frequencies
  • Passives: Filters, Duplexers, Dividers, Couplers
  • Antenna

Teramics works with a number of leading semiconductor foundries including TriQuint Semiconductor®, Northrop Grumman®, IBM®, Jazz®, Sumitomo®, Gree®, GCS® and WIN Semiconductor®

Packaging & Testing

Teramics complements its custom MMIC and RFIC design capabilities with turn-key surface-mount packaging and test services.

Teramics’ focus is on mm-wave packaging (including hermetic), high precision assemblies for space and military and tests to 300 GHz.

 

  • Teramics offers custom mm-wave surface-mount package designs including test fixture design, R&D and volume production test.
  • Teramics works with a number of leading packaging firms including Kyocera® and Stratedge®.
  • Teramics offers packaging and test of customer chips in custom hermetic, overmold, ceramic and air-cavity QFN packages including characterization and test (including test for hermeticity).
  • Teramics offers ATE hardware and software test development through its strategic partners for high volume as well as low-volume high-mix products.
  • Teramics offers services in nonlinear modeling, load-pull, noise parameters and X-parameters in collaboration with its strategic partners.

Consulting

Teramics offers consulting services to clients evaluating a new technology and/or product. Teramics specializes in compound semiconductor technologies and products in mm-wave and high speed optoelectronics markets.

 
 

Using a combination of state-of-the art simulation tools and a network of very experienced technical affiliates and consultants, Teramics offers a variety of services:

  • Space qualified turn-key IC design, test and packaging
  • Reliability testing
  • Failure analysis, SEMS, FIB
  • Cost reduction, obsolescence re-designs
  • Market analysis
  • Access to intellectual property
  • Evaluation of and recommendation for technology and product road maps

Teramics has expertise in a broad range of products and technologies in RF/Microwave & mm-wave Communications.