Welcome to your custom IC design center ...
where we design a differentiating product suited to your specific needs...

About Us

Teramics was founded in 2011 by Dr. Seyed Tabatabaei to provide dependable cutting-edge design services for advanced RF, Microwave and mm-wave integrated circuits, packages, PCB, Antenna and modules.

Our mission is simple: We solve the most challenging mm-wave design assignments with innovation and deliver on-time results with first pass success.


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  Seyed Tabatabaei, Ph.D.

President & CEO

Dr. Tabatabaei has been responsible for the definition, design, and release of > 300 RF, microwave and mm-wave ICs and modules throughout his 26 year career in mm-wave and Optoelectronics. His designs balance quality and reliability with performance specs and cost targets and are tailored to specific customer and market needs.

The Teramics team of designers with > 500 designs provides a diverse set of expertise in IC, Antenna, Surface-Mount Packages and Module design, as well as modeling and characterization to 300 GHz. Our expertise in mmwave applications and 40/100 Gbit/sec Optical communications will be a key asset to our clients in these markets. A sample of our clients include a leading supplier of systems for Ka band applications, a top tier provider of custom systems for high power applications, a tier 1 supplier of 40 and 100 Gbit/sec Optical Communication Systems, a tier 1 provider of test and measurement equipment, a leading provider of mm-wave point-to-point radios, and a high volume supplier in 3G and 4G cellular communication. At Teramics, we bring our clients' vision to reality with comprehensive design services in mm-wave frequency band..

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  Ed Stoneham, Ph.D.

Consultant

Dr. Stoneham brings over 40 years of experience in microelectronics. In his doctoral work at Stanford and his industry experience at Hewlett Packard, Microwave Technology, Pacific Monolithics, and Endwave he has contributed many firsts in the areas of materials science, device physics, process development, equipment design, circuit design, packaging, subsystem design, and electromagnetics. As Advanced Technology Director and Engineering Fellow at Endwave Corporation, he developed the MLMS™ flip-chip integration technology, the Epsilon™ laminate subsystem packaging technology, and the EW600 series of low-cost credit-card-sized 60-GHz transceivers. He is currently active in electronics consulting, stock investing, and development of LED lighting products, and he has more than a decade of experience on boards of nonprofit and for-profit organizations. Dr. Stoneham is a Member of Phi Beta Kappa and Sigma Xi and Senior Member of IEEE and is an author of nineteen U.S. patents.